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DeepMaterial is low temperature cure bga flip chip underfill pcb epoxy process adhesive glue material manufacturer,supply industrial appliance structural bonding epoxy adhesive glue,low refractive index epoxy resin adhesive glue,high refractive index optical adhesive glue,best glue for magnet to pla

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LAST ACTIVE Aug 26, 2023(2 years ago)
JOINEDAug 26, 2023(2 years ago)

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